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NTJD4152P
Trench Small Signal
MOSFET
20 V, 0.88 A, Dual P ? Channel,
ESD Protected SC ? 88
Features
? Leading Trench Technology for Low R DS(ON) Performance
? Small Footprint Package (SC70 ? 6 Equivalent)
? ESD Protected Gate
? This is a Pb ? Free Device
V (BR)DSS
? 20 V
http://onsemi.com
R DS(on) Typ
215 m W @ ? 4.5 V
345 m W @ ? 2.5 V
I D Max
? 0.88 A
Applications
? Load/Power Management
? Charging Circuits
? Load Switching
? Cell Phones, Computing, Digital Cameras, MP3s and PDAs
S 1
1
600 m W @ ? 1.8 V
6
D 1
MAXIMUM RATINGS (T J = 25 ° C unless otherwise stated)
Parameter Symbol
Value
Unit
G 1
2
5
G 2
Drain ? to ? Source Voltage
V DSS
? 20
V
Gate ? to ? Source Voltage
V GS
± 12
V
D 2
3
4
S 2
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady
State
Steady
State
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 85 ° C
I D
P D
? 0.88
? 0.63
0.272
0.141
A
W
Top View
MARKING DIAGRAM &
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Pulsed Drain Current
t v 5s
t v 5s
T A = 25 ° C
T A = 85 ° C
T A = 25 ° C
T A = 85 ° C
t ≤ 10 m s
I D
P D
I DM
? 1.0
? 0.72
0.35
0.181
± 3.0
A
W
A
1
SC ? 88/SOT ? 363
CASE 419B
STYLE 28
PIN ASSIGNMENT
D1 G2 S2
6
TK M G
G
Operating Junction and Storage Temperature
T J ,
T STG
? 55 to
150
° C
1
S1 G1 D2
Continuous Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I S
T L
? 0.48
260
A
° C
TK
M
G
= Device Code
= Date Code
= Pb ? Free Package
THERMAL RESISTANCE RATINGS (Note 1)
Parameter Symbol Max Unit
Junction ? to ? Ambient – Steady State R q JA 460 ° C/W
Junction ? to ? Ambient ? t v 5 s R q JA 357
Junction ? to ? Lead – Steady State R q JL 226
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces), steady state.
2. Surface mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces), t v 5 s.
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device Package Shipping
NTJD4152PT1G SOT ? 363 3000 / Tape & Reel
(Pb ? Free)
NTJD4152PT2G SOT ? 363 3000 / Tape & Reel
(Pb ? Free)
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2014
January, 2014 ? Rev. 5
1
Publication Order Number:
NTJD4152P/D
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